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AFS-250C 1㎡ On-line Selective Wave Soldering Machine
Boost your electronics production with the AFS-250C 1m2 On-line Selective Wave Soldering Machine, designed for high-precision PCB soldering in industrial electronics manufacturing. This CE-certified solution offers automated soldering with 90% flux savings and 95% tin slag reduction, ideal for OEM/ODM and bulk orders. Its modular design ensures seamless integration into existing lines, supporting PCB sizes up to 450x350mm and customized soldering parameters for complex through-hole components. Achieve zero-defect welding with programmable nozzle technology and cost-effective operation. Contact us for tailored solutions and FOB pricing to optimize your production efficiency.
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Product Overview
The AFS-250C is an online selective wave soldering machine engineered to address the challenges of modern electronics production. With a compact footprint of 1250L×1250W×1725H mm and a weight of ~1000 kg (Approx100OKG), it seamlessly integrates into automated production lines while maintaining robust performance. Operating on 3φ380V 50/60Hz power with a 12kW total power consumption, this machine is optimized for energy efficiency without compromising output quality.
Key highlights include:
PCB Handling: Supports PCBs ranging from 100×50 mm to 300×250 mm, with a maximum weight of 5 kg.
Component Clearance: Accommodates top components up to 130 mm and bottom components up to 30 mm, ideal for complex mixed-technology boards.
Intelligent Control: Features a PC+motion control card system for intuitive programming, real-time monitoring, and data logging.
By combining selective soldering and flux spraying in a single platform, the AFS-250C minimizes manual intervention, reduces material waste, and ensures consistent solder joint integrity. Its modular design allows for easy scalability, making it suitable for both prototyping and high-volume production.
Features
High-Precision Soldering System
The selective soldering module employs a XYZ-axis solder pot movement driven by servo motors and linear rails, enabling micron-level accuracy. With a 16 kg solder capacity and 25-minute melting time, it supports lead-free and traditional soldering processes. The standard D8mm nozzle (with optional sizes) ensures precise solder application, while N2 protection reduces oxidation and enhances joint quality, achieving 99.99% purity for critical applications.
Adaptive Flux Spraying
The selective spray system utilizes a needle nozzle and servo-controlled linear rail to deliver flux with ±0.1 mm precision. A 2L flux volume tank allows continuous operation, while adjustable parameters (e.g., spray pressure, duration) optimize flux distribution for diverse PCB layouts. This targeted approach reduces flux consumption by up to 30% compared to conventional wave soldering.
Advanced Preheating and Temperature Control
The top-mounted far-infrared preheating system ensures uniform thermal distribution across the PCB, minimizing thermal stress and improving solder wetting. Equipped with PID+SSR temperature control, it maintains stability within ±2°C, critical for heat-sensitive components. The system supports preheating temperatures up to 250°C, with a rapid warm-up time to accelerate production cycles.
Environmentally Friendly Design
The exhaust system efficiently removes fumes and particulates, featuring a 5 m³/h airflow capacity and 1PCS exhaust unit for compliance with safety standards. The N2 protection system further reduces environmental impact by minimizing solder oxidation and waste.
User-Centric Interface
The PC-based control panel offers a graphical interface for easy program creation, editing, and storage. Gerber file compatibility streamlines setup, while real-time diagnostics and error alerts enhance operational efficiency. The machine’s 900±25 mm operating height ensures ergonomic comfort for operators.
Applications
Consumer Electronics
Ideal for soldering smartphone PCBs, wearable devices, and IoT modules, where miniaturization and mixed-technology components (e.g., SMT and through-hole) require pinpoint accuracy. Its ability to handle small PCBs (100×50 mm) makes it suitable for prototyping and low-volume production.
Automotive Electronics
Critical for manufacturing ADAS sensors, automotive control modules, and infotainment systems, where solder joint integrity is non-negotiable. The N2 protection system ensures high-reliability connections in harsh environments.
Industrial Automation
Supports the production of PLCs, robotics controllers, and power electronics, where robust soldering is essential for long-term performance. The machine's modular design allows integration into automated assembly lines for seamless scalability.
Medical Devices
Compliant with ISO 13485 standards, the AFS-250C ensures traceability and repeatability for surgical equipment, diagnostic tools, and implantable devices. Its PID temperature control mitigates risks of thermal damage to sensitive components.
PCBA Field
Electronic Components
Industrial Control
Aerospace
Home Appliances
Military Electronics
Marine Electronics
Automotive Electronics
Communication Equipment
Stage Lighting
New Energy
Medical Devices
FAQ
Q1: What is the maximum PCB size the AFS-250C can handle?
A1: The machine supports PCBs from 100×50 mm (min) to 300×250 mm (max), with a maximum weight of 5 kg. This accommodates a wide range of board sizes, from compact modules to mid-sized industrial PCBs.
Q2: How does the N2 protection system work?
A2: The N2 protection system floods the soldering area with inert nitrogen gas (99.99% purity), reducing oxidation of the solder and PCB surfaces. This results in cleaner, more reliable solder joints and extends the lifespan of the solder pot.
Q3: Can the AFS-250C handle lead-free soldering?
A3: Yes, the machine is fully compatible with lead-free soldering processes. Its PID-controlled heating system maintains precise temperatures required for lead-free alloys, ensuring optimal wetting and joint strength.
Product Overview
The AFS-250C is an online selective wave soldering machine engineered to address the challenges of modern electronics production. With a compact footprint of 1250L×1250W×1725H mm and a weight of ~1000 kg (Approx100OKG), it seamlessly integrates into automated production lines while maintaining robust performance. Operating on 3φ380V 50/60Hz power with a 12kW total power consumption, this machine is optimized for energy efficiency without compromising output quality.
Key highlights include:
PCB Handling: Supports PCBs ranging from 100×50 mm to 300×250 mm, with a maximum weight of 5 kg.
Component Clearance: Accommodates top components up to 130 mm and bottom components up to 30 mm, ideal for complex mixed-technology boards.
Intelligent Control: Features a PC+motion control card system for intuitive programming, real-time monitoring, and data logging.
By combining selective soldering and flux spraying in a single platform, the AFS-250C minimizes manual intervention, reduces material waste, and ensures consistent solder joint integrity. Its modular design allows for easy scalability, making it suitable for both prototyping and high-volume production.
Features
High-Precision Soldering System
The selective soldering module employs a XYZ-axis solder pot movement driven by servo motors and linear rails, enabling micron-level accuracy. With a 16 kg solder capacity and 25-minute melting time, it supports lead-free and traditional soldering processes. The standard D8mm nozzle (with optional sizes) ensures precise solder application, while N2 protection reduces oxidation and enhances joint quality, achieving 99.99% purity for critical applications.
Adaptive Flux Spraying
The selective spray system utilizes a needle nozzle and servo-controlled linear rail to deliver flux with ±0.1 mm precision. A 2L flux volume tank allows continuous operation, while adjustable parameters (e.g., spray pressure, duration) optimize flux distribution for diverse PCB layouts. This targeted approach reduces flux consumption by up to 30% compared to conventional wave soldering.
Advanced Preheating and Temperature Control
The top-mounted far-infrared preheating system ensures uniform thermal distribution across the PCB, minimizing thermal stress and improving solder wetting. Equipped with PID+SSR temperature control, it maintains stability within ±2°C, critical for heat-sensitive components. The system supports preheating temperatures up to 250°C, with a rapid warm-up time to accelerate production cycles.
Environmentally Friendly Design
The exhaust system efficiently removes fumes and particulates, featuring a 5 m³/h airflow capacity and 1PCS exhaust unit for compliance with safety standards. The N2 protection system further reduces environmental impact by minimizing solder oxidation and waste.
User-Centric Interface
The PC-based control panel offers a graphical interface for easy program creation, editing, and storage. Gerber file compatibility streamlines setup, while real-time diagnostics and error alerts enhance operational efficiency. The machine’s 900±25 mm operating height ensures ergonomic comfort for operators.
Applications
Consumer Electronics
Ideal for soldering smartphone PCBs, wearable devices, and IoT modules, where miniaturization and mixed-technology components (e.g., SMT and through-hole) require pinpoint accuracy. Its ability to handle small PCBs (100×50 mm) makes it suitable for prototyping and low-volume production.
Automotive Electronics
Critical for manufacturing ADAS sensors, automotive control modules, and infotainment systems, where solder joint integrity is non-negotiable. The N2 protection system ensures high-reliability connections in harsh environments.
Industrial Automation
Supports the production of PLCs, robotics controllers, and power electronics, where robust soldering is essential for long-term performance. The machine's modular design allows integration into automated assembly lines for seamless scalability.
Medical Devices
Compliant with ISO 13485 standards, the AFS-250C ensures traceability and repeatability for surgical equipment, diagnostic tools, and implantable devices. Its PID temperature control mitigates risks of thermal damage to sensitive components.
PCBA Field
Electronic Components
Industrial Control
Aerospace
Home Appliances
Military Electronics
Marine Electronics
Automotive Electronics
Communication Equipment
Stage Lighting
New Energy
Medical Devices
FAQ
Q1: What is the maximum PCB size the AFS-250C can handle?
A1: The machine supports PCBs from 100×50 mm (min) to 300×250 mm (max), with a maximum weight of 5 kg. This accommodates a wide range of board sizes, from compact modules to mid-sized industrial PCBs.
Q2: How does the N2 protection system work?
A2: The N2 protection system floods the soldering area with inert nitrogen gas (99.99% purity), reducing oxidation of the solder and PCB surfaces. This results in cleaner, more reliable solder joints and extends the lifespan of the solder pot.
Q3: Can the AFS-250C handle lead-free soldering?
A3: Yes, the machine is fully compatible with lead-free soldering processes. Its PID-controlled heating system maintains precise temperatures required for lead-free alloys, ensuring optimal wetting and joint strength.
