Space-Saving Compact Inline Automated Selective Wave Soldering Machine

Product Overview

The AFS-250C is an Inline selective wave soldering machine engineered to address the challenges of modern electronics production. With a compact footprint of 1260L×1350W×1730H mm, it seamlessly integrates into automated production lines while maintaining robust performance. Operating on 3φ380V 50/60Hz power with a 12kW total power consumption, this machine is optimized for energy efficiency without compromising output quality.

Key highlights include:

• Versatile PCB Handling: Accommodates board dimensions from 100×50 mm up to 330×250 mm, supporting a maximum payload of 5 kg to suit diverse project requirements.

• Optimal Component Clearance: Engineered for mixed-technology boards, it allows top component clearances up to 130 mm and bottom clearances up to 30 mm.

• Intelligent Control Architecture: Utilizes a reliable PC + motion control card system to facilitate intuitive programming, real-time process monitoring, and comprehensive data logging for quality assurance.

By consolidating selective soldering and flux spraying into a single, streamlined platform, the AFS-250C significantly minimizes manual handling, reduces material waste, and guarantees uniform solder joint integrity. Its modular architecture supports flexible scalability, making it an excellent investment for both rapid prototyping and full-scale production environments.

Features

High-Precision Soldering System

The selective soldering module features an XYZ-axis solder pot movement driven by precise servo motors and linear rails, ensuring micron-level positioning accuracy. Equipped with a 16 kg solder capacity and a rapid 25-minute melting time, it is fully optimized for both lead-free and traditional soldering processes. The standard D8mm nozzle (with optional sizes available) delivers targeted solder application, while the integrated N2 protection system achieves 99.99% purity, drastically reducing oxidation and ensuring superior joint reliability for critical assemblies.

Adaptive Flux Spraying

Utilizing a specialized needle nozzle paired with a servo-controlled linear rail, the selective spray system applies flux with an impressive ±0.1 mm precision. The system includes a 2L flux volume tank for uninterrupted operation. Operators can easily adjust spray pressure and duration to match specific PCB layouts. This targeted approach can reduce flux consumption by up to 30% compared to conventional wave soldering methods, directly lowering consumable costs.

Advanced Preheating and Temperature Control

A top-mounted far-infrared preheating system guarantees uniform thermal distribution across the entire PCB. This minimizes thermal stress on sensitive components and significantly improves solder wetting. Driven by a PID+SSR temperature control mechanism, the system maintains thermal stability within ±2°C. Capable of reaching preheating temperatures up to 250°C, its rapid warm-up capability helps accelerate overall production cycles.

Environmentally Friendly Design

To maintain a safe and clean working environment, the built-in exhaust system efficiently extracts fumes and particulates, featuring a 5 m³/h airflow capacity and a dedicated 1PCS exhaust unit to comply with industrial safety standards. Furthermore, the N2 protection system minimizes solder dross formation, reducing both environmental impact and material waste.

User-Centric Interface

The PC-based control panel provides a clear graphical interface that simplifies program creation, editing, and recipe storage. Full Gerber file compatibility streamlines the initial setup process, reducing downtime between product changeovers. Real-time diagnostics and automated error alerts further enhance operational efficiency, while the machine’s ergonomic 900±25 mm operating height ensures comfortable access for operators.

Applications

Consumer Electronics

Highly suitable for soldering smartphone PCBs, wearable devices, and IoT modules where miniaturization and mixed-technology components demand pinpoint accuracy. Its capability to process small PCBs down to 100×50 mm provides flexibility for low-volume runs and rapid prototyping.

Automotive Electronics

Essential for the production of ADAS sensors, automotive control modules, and infotainment systems. In these applications, solder joint reliability is critical. The 99.99% N2 protection system ensures durable connections capable of withstanding harsh automotive environments.

Industrial Automation

Supports the reliable manufacturing of PLCs, robotics controllers, and industrial power electronics. The machine's robust soldering capabilities ensure long-term performance, while its modular design allows for straightforward integration into fully automated assembly lines.

Medical Devices

Meeting stringent quality requirements, the AFS-250C provides the traceability and repeatability necessary for surgical equipment, diagnostic tools, and implantable devices. The precise PID temperature control eliminates the risk of thermal damage to highly sensitive medical components.

PCBA Field

Electronic Components

Industrial Control

Aerospace

Home Appliances

Military Electronics

Marine Electronics

Automotive Electronics

Communication Equipment

Stage Lighting

New Energy

Medical Devices

FAQ

Q1: What is the maximum PCB size the AFS-250C can handle?

A1: The machine is engineered to support a versatile range of PCB dimensions, from a minimum of 100×50 mm up to a maximum of 330×250 mm, with a maximum weight capacity of 5 kg. This broad compatibility ensures it can process everything from compact communication modules to mid-sized industrial control boards, meeting diverse procurement and assembly needs.

Q2: How does the N2 protection system work?

A2: The integrated N2 protection system floods the localized soldering area with inert nitrogen gas, achieving 99.99% purity. This displaces oxygen, significantly reducing the oxidation of both the liquid solder and the PCB pads. For manufacturers, this means cleaner, highly reliable solder joints, fewer defects, and a substantial reduction in solder dross, which extends the lifespan of the solder pot and lowers maintenance costs.

Q3: Can the AFS-250C handle lead-free soldering?

A3: Yes, the equipment is fully designed for lead-free soldering processes. It utilizes an advanced PID+SSR temperature control system that maintains the precise, higher thermal profiles required for lead-free alloys. This ensures optimal solder wetting and strong joint integrity while preventing thermal shock to sensitive electronic components.